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Bond Instrumentation And Engineering Company (23553900K) Sole Proprietor

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    Bond Instrumentation And Engineering Company Details

    Bond Instrumentation And Engineering Company

    The Bond Instrumentation And Engineering Company is a Sole Proprietor (Installation Of Industrial Machinery And Equipment, Mechanical Engineering Works) business based company which is located in Chong Kuo Road, Singapore (2677). The Unique Entity Number (UEN) of Bond Instrumentation And Engineering Company is 23553900K which was issued on 2008-09-09 00:00:00. Bond Instrumentation And Engineering Company was incorporated on 25 Jan 1978 and the primary ssic code of Bond Instrumentation And Engineering Company company is 28300 and primary ssic description is Installation Of Industrial Machinery And Equipment, Mechanical Engineering Works.

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    Company Name Bond Instrumentation And Engineering Company
    Street Addres Chong Kuo Road, Singapore (2677)
    Postal Code 2677
    UEN Number 23553900K
    Incorporation Date 25 Jan 1978
    Country Singapore
    UEN Issue Date 2008-09-09 00:00:00
    Primary SSIC Code 28300
    Primary SSIC Description Installation Of Industrial Machinery And Equipment, Mechanical Engineering Works
    Primary User Described Activity na
    Secondary SSIC Code na
    Secondary SSIC Description Na
    Secondary User Described Activity na
    Status na
    Company Type Sole Proprietor
    Entity type Business
    No of officers 2

    Basic Details of Bond Instrumentation And Engineering Company

    What is the Uen (Unique Entity Number) of Bond Instrumentation And Engineering Company company?

    The Unique Entity Number (UEN) of Bond Instrumentation And Engineering Company is 23553900K

    What is the Uen (Unique Entity Number) issue date of Bond Instrumentation And Engineering Company company?

    The Unique Entity Number (UEN) issue date of Bond Instrumentation And Engineering Company is 2008-09-09 00:00:00

    What is the registration or incorporation date of Bond Instrumentation And Engineering Company company?

    The Bond Instrumentation And Engineering Company was incorporated on 25 Jan 1978

    What is the primary ssic code of Bond Instrumentation And Engineering Company company?

    The primary ssic code of Bond Instrumentation And Engineering Company company is 28300

    What is the primary ssic description of Bond Instrumentation And Engineering Company company?

    The primary ssic description of Bond Instrumentation And Engineering Company company is Installation Of Industrial Machinery And Equipment, Mechanical Engineering Works

    What is the primary user described activity of Bond Instrumentation And Engineering Company company?

    The primary user described activity of Bond Instrumentation And Engineering Company company is na.

    What is the secondary ssic code of Bond Instrumentation And Engineering Company company?

    The secondary ssic code of Bond Instrumentation And Engineering Company company is na

    What is the secondary ssic description of Bond Instrumentation And Engineering Company company?

    The secondary ssic description of Bond Instrumentation And Engineering Company company is Na

    What is the secondary user described activity of Bond Instrumentation And Engineering Company company?

    The secondary user described activity of Bond Instrumentation And Engineering Company company is na

    What is the current status of Bond Instrumentation And Engineering Company company?

    The current status of Bond Instrumentation And Engineering Company company is na

    What is the type of Bond Instrumentation And Engineering Company company?

    The Bond Instrumentation And Engineering Company is a Sole Proprietor company

    Contact Details of Bond Instrumentation And Engineering Company

    Where is the Registered Office Address of Bond Instrumentation And Engineering Company?

    The Bond Instrumentation And Engineering Company registered office address is Chong Kuo Road, Singapore (2677).

    What is the postal code of Bond Instrumentation And Engineering Company company?

    Postal code of Bond Instrumentation And Engineering Company is 2677

    What is the entity type description of Bond Instrumentation And Engineering Company company?

    The entity type description of Bond Instrumentation And Engineering Company company is Business

    How many No of officers in Bond Instrumentation And Engineering Company company?

    There are 2 officers in Bond Instrumentation And Engineering Company company

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